Patents
Release time: 2024-06-14Hits:
- Affilication of Author(s):材料学院
- Scope of patent:国内
- Patent Applicant:梁芷暄,DLZ,杨羽歆,唐振斌,吴晨至,XYT,CBR,CGR,LWA
- Type of Patent:发明专利
- State of Patent:专利申请,专利公开,专利授权,预申请
- Application Number:202110825998.9
- Authorization number:202110825998.9
- Service Invention or Not:yes
- First Author:YCH
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MOBILE Version