厦门大学平台管理系统 ZY--Home-- Study on the cracking mechanism of Au Bump during temperature-humidity test

Personal Information

MORE+

Associate professor

Date of Employment:2021-03-05

School/Department:电子科学与技术学院（国家示范性微电子学院）

Education Level:博士研究生毕业

Gender:Male

Degree:Doctor of Engineering (D.Eng.)

Status:在职

钟毅

Gender:Male

Education Level:博士研究生毕业

Paper Publications

Current position: Home / Scientific Research / Paper Publications

Study on the cracking mechanism of Au Bump during temperature-humidity test

Journal:2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022
Co-author:ZY
Indexed by:Conference article (CA)
Translation or Not:no

Pre One:Study on Warpage of Interposer by Chip Distribution

Next One:Stress Issues in 3D Interconnect Technology Using Through Glass Vias