钟毅
Gender:Male
Education Level:博士研究生毕业
Paper Publications
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集成电路互连微纳米尺度硅通孔技术进展.电子与封装,2024,24(06):115-124.
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ZY.Quasi-2D Phonon Transport in Diamond Nanosheet.Advanced Functional Materials,
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ZY,Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers.Journal of Materials Science and Technology,2024,18837-43.
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ZY.Fine Pitch Wafer-to -Wafer Hybrid Bonding for Three -Dimensional Integration.2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,
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ZY,Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers.SURFACES AND INTERFACES,2023,46
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YDQ,CQJ,ZY.Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces.SURFACES AND INTERFACES,2023,46
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YDQ,LX,ZY.Triple Cross-Linking Engineering Strategies for Efficient and Stable Inverted Flexible Perovskite Solar Cells.SMALL,2024,
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ZY.Significantly Enhanced Bonding Strength in Al2o3/Hfo2 Using Nanolaminate Interfaces.SSRN,2023,
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ZY.Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers.SSRN,2023,
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ZY,Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management.IEEE Electron Device Letters,45(3):1-1.