YDQ,ZY.Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging.Sensors,2023,24(1):

ZY.Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging.IEEE Electron Device Letters,44(9):1-1.

ZY.Low Temperature Cu-to-Cu Bonding with High Thermal Boundary Conductance Achieved by Coating Metal Nanolayers.SSRN,2023,

ZY,芯片三维互连技术及异质集成研究进展.电子与封装,2023,23(03):18-28.

ZY.On the optimization of molding warpage for wafer-level glass interposer packaging.Journal of Materials Science: Materials in Electronics,2022,34(12):

ZY.Study on Warpage of Interposer by Chip Distribution.2022 7th International Conference on Integrated Circuits and Microsystems, ICICM 2022,149-152.

ZY.Study on the cracking mechanism of Au Bump during temperature-humidity test.2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,

ZY.Stress Issues in 3D Interconnect Technology Using Through Glass Vias.Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,2022,58(2):246-258.

YDQ,ZY.Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter.SENSORS,2021,22(6):