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Associate professor

Date of Employment:2021-03-05

School/Department:电子科学与技术学院（国家示范性微电子学院）

Education Level:博士研究生毕业

Gender:Male

Degree:Doctor of Engineering (D.Eng.)

Status:在职

钟毅

Gender:Male

Education Level:博士研究生毕业

Paper Publications

Current position: Home / Scientific Research / Paper Publications

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Journal:Sensors
Co-author:ZY
Indexed by:Journal article (JA)
Correspondence Author:YDQ
Volume:24
Issue:1
Translation or Not:no
Date of Publication:2023-12-01

Pre One:Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management

Next One:Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging