厦门大学平台管理系统钟毅--中文主页-- Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers

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Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers

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发表刊物：SSRN

合写作者：钟毅

论文类型：Preprint (PP)

是否译文：否

发表时间：2023-11-08

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