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钟毅
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副教授
- 入职时间：2021-03-05
- 所在单位：电子科学与技术学院（国家示范性微电子学院）
- 学历：博士研究生毕业
- 性别：男
- 学位：工学博士学位
- 在职信息：在职
访问量：
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[ 1 ]集成电路互连微纳米尺度硅通孔技术进展.电子与封装,2024,24(06):115-124.
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[ 2 ]钟毅.Quasi-2D Phonon Transport in Diamond Nanosheet.Advanced Functional Materials,
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[ 3 ]钟毅,Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers.Journal of Materials Science and Technology,2024,18837-43.
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[ 4 ]钟毅.Fine Pitch Wafer-to -Wafer Hybrid Bonding for Three -Dimensional Integration.2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,
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[ 5 ]钟毅,Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers.SURFACES AND INTERFACES,2023,46
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[ 6 ]于大全,程其进,钟毅.Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces.SURFACES AND INTERFACES,2023,46
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[ 1 ]YMTC 供应商从业道德规范承诺函,在研,长江存储,钟毅,
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[ 2 ]基于低温键合金刚石的玻璃转接板多芯粒集成散热技术研究,在研,钟毅,钟毅,戴彬
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[ 3 ]ZX2AA453金刚石bonding采购订单,在研,西安克瑞斯半导体技术有限公司,钟毅,
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[ 4 ]ZX2AA453金刚石bonding,在研,西安克瑞斯半导体技术有限公司,钟毅,
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[ 5 ]ZX2AA453金刚石bonding招标项目,在研,西安克瑞斯半导体技术有限公司,钟毅,
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[ 6 ]中兴微电子供应商CSR（企业社会责任）行为承诺书,在研,深圳市中兴微电子技术有限公司,钟毅,
