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钟毅
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助理教授
- 入职时间：2021-03-05
- 所在单位：电子科学与技术学院（国家示范性微电子学院）
- 学历：博士研究生毕业
- 性别：男
- 学位：工学博士学位
- 在职信息：在职
访问量：
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[1]集成电路互连微纳米尺度硅通孔技术进展.电子与封装,2024,24(06):115-124.
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[2]钟毅.Quasi-2D Phonon Transport in Diamond Nanosheet.Advanced Functional Materials,
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[3]钟毅,Low-temperature bonding of Si and polycrystalline diamond with ultra-low thermal boundary resistance by reactive nanolayers.Journal of Materials Science and Technology,2024,18837-43.
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[4]钟毅.Fine Pitch Wafer-to -Wafer Hybrid Bonding for Three -Dimensional Integration.2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023,
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[5]钟毅,Interdiffusion mechanism and thermal conductance at the interfaces in Cu-to-Cu bonds achieved by coating nanolayers.SURFACES AND INTERFACES,2023,46
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[6]于大全,程其进,钟毅.Significantly enhanced bonding strength in Al2O3/HfO2 using nanolaminate interfaces.SURFACES AND INTERFACES,2023,46
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[7]于大全,李鑫,钟毅.Triple Cross-Linking Engineering Strategies for Efficient and Stable Inverted Flexible Perovskite Solar Cells.SMALL,2024,
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[8]钟毅.Significantly Enhanced Bonding Strength in Al2o3/Hfo2 Using Nanolaminate Interfaces.SSRN,2023,
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[9]钟毅.Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Low-Temperature Cu-to-Cu Bonds Achieved by Coating Nanolayers.SSRN,2023,
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[10]钟毅,Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management.IEEE Electron Device Letters,45(3):1-1.
