![]()
钟毅
-
副教授
- 入职时间：2021-03-05
- 所在单位：电子科学与技术学院（国家示范性微电子学院）
- 学历：博士研究生毕业
- 性别：男
- 学位：工学博士学位
- 在职信息：在职
访问量：
-
[11]于大全,钟毅.Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging.Sensors,2023,24(1):
-
[12]钟毅.Development of Low Cost Glass-Based Deep Trench Capacitor for 3D Packaging.IEEE Electron Device Letters,44(9):1-1.
-
[13]钟毅.Low Temperature Cu-to-Cu Bonding with High Thermal Boundary Conductance Achieved by Coating Metal Nanolayers.SSRN,2023,
-
[14]钟毅,芯片三维互连技术及异质集成研究进展.电子与封装,2023,23(03):18-28.
-
[15]钟毅.On the optimization of molding warpage for wafer-level glass interposer packaging.Journal of Materials Science: Materials in Electronics,2022,34(12):
-
[16]钟毅.Study on Warpage of Interposer by Chip Distribution.2022 7th International Conference on Integrated Circuits and Microsystems, ICICM 2022,149-152.
-
[17]钟毅.Study on the cracking mechanism of Au Bump during temperature-humidity test.2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022,
-
[18]钟毅.Stress Issues in 3D Interconnect Technology Using Through Glass Vias.Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,2022,58(2):246-258.
-
[19]于大全,钟毅.Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter.SENSORS,2021,22(6):
